The electric current applied causes an oxidation-reduction reaction of metal ions between the cathode and the anode.
Plating is a process that generally limits deposition to a thickness of up to 20 microns. It is used for decorative purposes on an object.
Electroforming, meanwhile, gives a thick deposit often greater than 100 microns and up to 300 microns or even more.
Virtually no limitation in deposit thickness.
The deposit can be separated from the substrate.
Personalized after-sales service.
Accuracy: Longer deposition time compared to plating
Creation of complex shapes and hollow parts with high precision.
Precise reproduction of the desired shape.
Possibility of electroforming 14K, 18K, 21K and 24K gold as well as silver. Platinum electroforming is under development.